Our capabilities include PCBA, SMT with Automated Optical Inspection, Wire-bonding, Thru-hole, and Wave Soldering

Capabilities

Capabilities - PCBA

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Printed Circuit Board
Assembly (PCBA)

Services

  • Design, simulation and layout of printed circuit
  • Design-for-manufacture (DFM)
  • Design-for-test analysis (DFTA)
  • Process failure mode effect analysis (PFMEA) & standard FMEA
  • Cross functional teams to work with new product introductory
  • Dedicated prototype environment for flexibility and control

Customer Benefits

  • Design or co-design of the PCBA
  • Cost Reduction Analysis
  • Prototyping - fast turn
  • From small to complex board assembly
  • Flexible manufacturing options
  • Customer focused prototyping teams
    for pre & post prototype analysis

Capabilities

  • Schematic Capture
  • PCB Design
  • Layout for various complexities: single and multilayer PCB fabrications and finishes
  • Mixed technologies
  • Both thru-hole and SMT designs
  • BGA - plastic & ceramic
  • Fine pitch components
  • Thru-hole assembly
  • SMT lines - fully automatic high speed lines
  • BGA and fine pitch component assembly
  • Lead Free Reflow ovens
  • Lead Free Dual Wave machines
  • X-Ray Inspection
  • Automatic Optical Inspection (AOI)
  • Assembly standards
  • 0201 chips
  • Chip on Board (high speed wire bonding)
  • Lead free assembly (RoHS compliant)
  • IN-Circuit-Test (ICT)
  • Odd forms
  • Various board geometries